Convective Heat Transfer With Gaseous Flow in Microducts

Abstract

Over the past couple of decades, there has been significant research and technology advancement in the field of microscale flow and convection heat transfer systems. This is mainly due to the increased requirement for the development of efficient and successful cooling techniques for integrated circuits and microchips. In addition, various other microsystems such as micro reactors, micro fuel cells, and micro valves, among others, involve flow and heat transfer phenomena at the microscale. The current trend in miniaturization, when combined with the overheating of smallscale heat dissipating components, has made the accurate prediction and solution of the microscale convection heat transfer problem essential and critical. As a consequence of detailed and consistent results in the literature, it will be possible to develop reliable thermal packaging systems with effective cooling techniques. Therefore, the fluid flow and heat transfer characteristics of microducts should be investigated and crucial parameters in design, including the pressure drop of the working fluid, fluid flow rate, wall and fluid temperatures, and size (hydraulic diameter, duct shape, number of channels) need to be optimized. Related research has been published in collective works such as books [1-3], edited volumes [4-8], and review articles [9-19]. The readers are referred to these excellent sources to gain in-depth understanding of the microscale flow and convection heat transfer phenomena. This chapter focuses on gaseous slip flow, with particular attention to the published. © 2016 by Taylor and Francis Group, LLC.