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https://hdl.handle.net/20.500.11851/10068| Title: | Refueling: Preventing wire degradation due to electromigration |
| Authors: | Abella, Jaume Vera, Xavier Ünsal, Osman S. Ergin, Oğuz Gonzalez, Antonio Tschanz, James W. Kartal, Yavuz Selim |
| Keywords: | FAILURE |
| Publisher: | IEEE MICRO |
| Abstract: | Electromigration is a major source of wire and via failure. Refueling undoes em for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits em's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires. |
| URI: | https://doi.org/10.1109/MM.2008.92 https://hdl.handle.net/20.500.11851/10068 |
| ISSN: | 0272-1732 1937-4143 |
| Appears in Collections: | Bilgisayar Mühendisliği Bölümü / Department of Computer Engineering WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection |
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